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Form Factor	U.2 2.5-inch
Interface	PCIe 5.0 @ U.2
NVMe Protocol	NVMe 2.0
NAND Flash	3D TLC
Available Capacity	3.2 TB	3.84 TB	6.4 TB	7.68 TB	15.36 TB
Model Number	HSSD-O0525PV3T2N	HSSD-O0525PL3T8N	HSSD-O0025PV6T4N	HSSD-O0025PL7T6N	HSSD-O0025PL15TN
Sequential Read/Write Bandwidth @ 128KB	14,800/8,200 MB/s	14,800/8,200 MB/s	14,800/11,000 MB/s	14,800/11,000 MB/s	14,800/11,000 MB/s
Random Read/Write IOPS @ 4KB	3,000/720 k	3,000/320 k	3,450/900 k	3,450/470 k	3,300/500 k
Average Read/Write Latency @ 1QD	58/7 μs	58/7 μs	55/7 μs	55/7 μs	56/7 μs
Endurance¹	3 DWPD, 5 years	1 DWPD, 5 years	3 DWPD, 5 years	1 DWPD, 5 years	1 DWPD, 5 years
Max. Data Written²	17.52 PBW	7.008 PBW	35.04 PBW	14.016 PBW	28.032 PBW
Weight (g)	＜200 g
Average Power Consumption (Idle, Active)	＜5 W (Idle), 18 W (Active)
Reliability	Meantime between failures (MTBF): 2.5 million hours Annual failure rate (AFR): ≤ 0.35% Uncorrectable bit error rate (UBER): 10^-18
Temperature	Non-operational: –40oC to 85oC (–40°F to 185oF) Operational: 0oC to 83oC(32oF to 181.4oF)
TRIM	Supported
Power Failure Protection	Supported
Chip Failure Protection	Supported
Certifications	China: RoHS; Europe: WEEE & RoHS & REACH & CE; Northern America: NRTL; Canada: IC; Japan: VCCI; Australia: RCM; Member States of IEEE: CB; UK: UKCA

Model

Huawei OceanDisk 300P PCIe 5.0 SSD

Form Factor

U.2 2.5-inch

Interface

PCIe 5.0 @ U.2

NVMe Protocol

NVMe 2.0

NAND Flash

3D TLC

Available Capacity

3.2 TB

3.84 TB

6.4 TB

7.68 TB

15.36 TB

Model Number

HSSD-O0525PV3T2N

HSSD-O0525PL3T8N

HSSD-O0025PV6T4N

HSSD-O0025PL7T6N

HSSD-O0025PL15TN

Sequential Read/Write Bandwidth @ 128KB

14,800/8,200 MB/s

14,800/11,000 MB/s

Random Read/Write IOPS @ 4KB

3,000/720 k

3,000/320 k

3,450/900 k

3,450/470 k

3,300/500 k

Average Read/Write Latency @ 1QD

58/7 μs

55/7 μs

56/7 μs

Endurance¹

3 DWPD, 5 years

1 DWPD, 5 years

3 DWPD, 5 years

1 DWPD, 5 years

Max. Data Written²

17.52 PBW

7.008 PBW

35.04 PBW

14.016 PBW

28.032 PBW

Weight (g)

＜200 g

Average Power Consumption (Idle, Active)

＜5 W (Idle), 18 W (Active)

Reliability

Meantime between failures (MTBF): 2.5 million hours
Annual failure rate (AFR): ≤ 0.35%
Uncorrectable bit error rate (UBER): 10^-18

Temperature

Non-operational: –40oC to 85oC (–40°F to 185oF)
Operational: 0oC to 83oC(32oF to 181.4oF)

TRIM

Supported

Power Failure Protection

Supported

Chip Failure Protection

Supported

Certifications

China: RoHS; Europe: WEEE & RoHS & REACH & CE;
Northern America: NRTL; Canada: IC; Japan: VCCI; Australia: RCM;
Member States of IEEE: CB; UK: UKCA

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Przedsi?biorstwa

Huawei Cloud

Operatorzy sieci

Klienci

Korporacja

OceanDisk 300P PCIe 5.0 Series SSD

Specifications

Resources